金士頓eMCP則是將eMMC以及LPDDR封裝在一起，減小體積的同時還減少了電路鏈接設計，eMMC是採用3D NAND Flash，符合JEDEC eMMC 5.1規範標準，LPDDR則是採用LPDDR4x， 尺寸大小皆為11.5x13.0x Max 1.0mm，採用FBGA封装254 ball。
產品應用:
eMCP產品主要應用於智慧型手機、平板電腦等移動設備產品，也用在穿戴式裝置，如智慧手錶、智慧眼鏡，或是GPS導航裝置的理想儲存解决替代方案。
產品規格:
• Separate eMMC™ and LPDDR4x interfaces
• Operating temperature: –25°C to +85°C / Storage temperature: –55°C to +125°C
• Package size 221 ball FBGA (11.5 x 13.0 x Max 1.0mm) )
eMMC + LPDDR4x is 254 ball)
< eMMC™ - NAND>
• eMMC™ 5.1 interface (Compliant with eMMC™ Specification Ver.4.4, 4.41,4.5,5.0&5.1)
• NAND Density & Attribute: 16GB~64GB
• Bus mode
- High-speed eMMC™ protocol
- Provide variable clock frequencies of 0-400MHz.
- Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.
• Operating voltage range : VCCQ = 1.8 V/3.3 V, VCC = 3.3 V
< DRAM™ -LPDDR4x>
• Density: 16Gbits~32Gbits
• Power supply : VDD1 = 1.70V to 1.95V, VDD2=1.06V to 1.1V, VDDQ = 0.57V to 0.65V
• Quality - Lead-free (RoHS compliant) and Halogen-free
產品應用:
eMCP產品主要應用於智慧型手機、平板電腦等移動設備產品，也用在穿戴式裝置，如智慧手錶、智慧眼鏡，或是GPS導航裝置的理想儲存解决替代方案。
產品規格:
• Separate eMMC™ and LPDDR4x interfaces
• Operating temperature: –25°C to +85°C / Storage temperature: –55°C to +125°C
• Package size 221 ball FBGA (11.5 x 13.0 x Max 1.0mm) )
eMMC + LPDDR4x is 254 ball)
< eMMC™ - NAND>
• eMMC™ 5.1 interface (Compliant with eMMC™ Specification Ver.4.4, 4.41,4.5,5.0&5.1)
• NAND Density & Attribute: 16GB~64GB
• Bus mode
- High-speed eMMC™ protocol
- Provide variable clock frequencies of 0-400MHz.
- Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.
• Operating voltage range : VCCQ = 1.8 V/3.3 V, VCC = 3.3 V
< DRAM™ -LPDDR4x>
• Density: 16Gbits~32Gbits
• Power supply : VDD1 = 1.70V to 1.95V, VDD2=1.06V to 1.1V, VDDQ = 0.57V to 0.65V
• Quality - Lead-free (RoHS compliant) and Halogen-free